JEDEC membership within the embedded system

ECC has become a mainstay in embedded systems. However, the JEDEC membership initially did not recognize the need to accommodate ECC when it was developing the DDR2 specification. Most laptop chipsets did not support ECC at the time. Seeing the need for ECC that could be implemented on faster DDR2 memory modules in Embedded Systems, Virtium sponsored the ECC SODIMM specification within JEDEC, which has been extended now to DDR3 and DDR4 modules. thermal management. Incorporating a reduced height DDR3L VLP memory module helps improve airflow and provides a low profile, allowing OEMs to offer higher-reliability products that reduce total cost of ownership. Specific DDR3L VLP modules also offer single refresh rates, which are now essential to maximize performance in high-temperature embedded systems.

refer to: http://embedded-computing.com/articles/ruggedization-memory-module-design/

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